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300MHz to 2500MHz SiGe
Ultra-Low-Noise Amplifiers
Table 3. MAX2640 Typical Noise Parameters at V CC = +3V, T A = +25°C
FREQUENCY (MHz)
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
f MIN (dB)
0.66
0.69
0.72
0.75
0.78
0.82
0.85
0.89
0.93
0.97
1.01
1.06
?Γ opt ?
0.56
0.54
0.51
0.48
0.46
0.43
0.40
0.37
0.35
0.32
0.29
0.26
Γ opt ANGLE
21
25
30
35
40
45
50
56
62
68
77
84
R N ( Ω )
12.5
11.9
11.3
10.8
10.2
9.7
9.3
8.8
8.3
7.9
7.4
7.0
Table 4. MAX2641 Typical Noise Parameters at V CC = +3V, T A = +25°C
FREQUENCY (MHz)
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
f MIN (dB)
1.02
1.05
1.08
1.10
1.14
1.17
1.20
1.23
1.27
1.30
1.34
?Γ opt ?
0.43
0.40
0.38
0.36
0.32
0.30
0.28
0.25
0.22
0.19
0.17
Γ opt ANGLE
44
47
50
54
58
62
66
71
77
82
91
R N ( Ω )
12.4
11.8
11.3
10.8
10.3
9.9
9.4
9.0
8.6
8.3
8.0
Layout and Power-Supply Bypassing
A properly designed PC board is essential to any
RF/microwave circuit. Be sure to use controlled imped-
ance lines on all high-frequency inputs and outputs.
The power supply should be bypassed with decoupling
capacitors located close to the device V CC pins. For
long V CC lines, it may be necessary to add additional
decoupling capacitors. These additional capacitors
can be located further away from the device package.
Proper grounding of the GND pins is essential. If the
PC board uses a topside RF ground, connect it directly
to all GND pins. For a board where the ground plane is
not on the component side, the best technique is to
connect the GND pin to the board with a plated
through-hole close to the package.
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